Embedded Hardware Design
Affiliated with Euromicro

Microprocessors and Microsystems: Embedded Hardware Design (MICPRO) is a journal covering all design and architectural aspects related to embedded systems hardware. This includes different embedded system hardware platforms ranging from custom hardware via reconfigurable systems and application specific processors to general purpose embedded processors. Special emphasis is put on novel complex embedded architectures, such as systems on chip (SoC), systems on a programmable/reconfigurable chip (SoPC) and multi-processor systems on a chip (MPSoC), as well as, their memory and communication methods and structures, such as network-on-chip (NoC).

Design automation of such systems including methodologies, techniques, flows and tools for their design, as well as, novel designs of hardware components fall within the scope of this journal. Novel cyber-physical applications that use embedded systems are also central in this journal. While software is not in the main focus of this journal, methods of hardware/software co-design, as well as, application restructuring and mapping to embedded hardware platforms, that consider interplay between software and hardware components with emphasis on hardware, are also in the journal scope.

Special Issue on Defect and Fault Tolerance in VLSI and Nanotechnology Systems
截稿日期: 2024-11-30

Defect and fault tolerance in VLSI and nanotechnology systems including emerging technologies, RISC-V architectures and AI-based solutions, are pervasive topics spanning domains and applications. This special issue features both new academic research and state-of-the-art industrial data, necessary ingredients for significant advances in this field. All aspects of design, manufacturing, test, reliability, availability, and security that are affected by defects during manufacturing and by faults during system operation are of interest.

Guest editors:

Dr. Jaume Abella

Computer Architecture and Operating Systems Interface (CAOS) Group Leader Barcelona Supercomputing Center (BSC), Barcelona, Spain

Email: jaume.abella@bsc.es

https://www.bsc.es/discover-bsc/organisation/scientific-structure/computer-architecture-operating-systems-caos

Jaume Abella co-leads the CAOS research group (embedded systems group) at BSC, where he works since 2009. Before, Jaume got his PhD (2005) and worked as Senior Researcher at Intel Corporation (2005-2009). Jaume leads the Horizon Europe SAFEXPLAIN project, and is (has been) the PI at BSC of several EU projects on enabling the use of high-performance hardware and software, as well as AI in safety-critical systems, in different funding frameworks such as Horizon Europe (NimbleAI, SAFEXPLAIN), Chips JU (SMARTY, ISOLDE, REBECCA), H2020 (SELENE, DeRISC, SAFURE), ECSEL (FRACTAL) and ARTEMIS (VeTeSS). Jaume has chaired the OpenHW Group Safety&Security Task Group (2023-2024) and vice-chaired the RISC-V International SIG-Safety (2022-2024). Dr. Abella holds 15 patents issued, has published around 250 papers in top peer- reviewed conferences and journals, has co-advised 15 PhDs and 20 Master theses, and co-founded a successful spinoff providing software services in avionics and automotive (Maspatechnologies S.L., now Rapita Systems S.L.). Jaume has been awarded with the most renowned national (Ramon y Cajal) and regional (Beatriu de Pinós) personal grants in Spain and Catalonia respectively. Jaume has organized a number of workshops, and tutorials, and given invited talks in topics related to functional safety and real-time systems in a number of venues (e.g., the opening keynote at the 28th Ada-Europe International Conference on Reliable Software Technologies, 2024). Jaume has been TPC member in around 50 conferences and workshops in the area of dependability and computer architecture including DATE, DFT, ETS, ICCD, and IOLTS among others, has been topic chair (3 times) and track chair (once) in DATE, and is the TPC co-chair of DFT’24. Jaume is also associated editor of the IEEE Transactions on Computers since 2022, and teaches functional safety for automotive systems at a Master program of the Universitat Politecnica de Catalunya (Spain) since 2018.

Dr. Adrian Evans

Research Engineer CEA/LIST, Grenoble France

Email: adrian.evans@cea.fr

Adrian Evans is a Research Engineer at CEA/LIST where his work focuses on fault tolerance and energy efficient compute solutions. Previously, he worked as a Senior Technical Leader at Cisco Systems (1999-2011) and as a Principal Engineer at IROC Technologies (2012-2017). He is the author or co-author of approximately 45 publications in international conferences or journals and is inventor / co-inventor of 6 patents. He has served on the TPC of several international conferences (DATE, IOLTS, DFTS, IRPS) and regularly reviews papers for journals such as IEEE TDMR and IEEE TNS. Adrian has co-organized several workshops at international conferences such as the recent CITaR workhop at ETS 2024 and he is an active member of the IEEE P3405 committee on repair of chiplet interconnects. He has given invited talks at international companies, such as at Huawei’s Engineering Innovation Days and presented invited talk/papers at conferences such as IRPS, ETS and DATE.

Special issue information:

Defect and fault tolerance in VLSI and nanotechnology systems including emerging technologies, RISC-V architectures and AI-based solutions, are pervasive topics spanning domains and applications. This special issue features both new academic research and state-of-the-art industrial data, necessary ingredients for significant advances in this field. All aspects of design, manufacturing, test, reliability, availability, and security that are affected by defects during manufacturing and by faults during system operation are of interest. Topics include (but are not limited to) the following:

1. Yield Analysis and Modeling

Defect/fault analysis and models; statistical yield modeling; diagnosis; critical area and other metrics.

2. Testing Techniques

Built-in self-test; delay fault modeling and diagnosis; testing for analog and mixed circuits; online testing; signal and clock integrity.

3. Design For Testability in IC Design

FPGA, SoC, NoC, ASIC, low power design and micro-processors, including RISC-V architectures

4. Error Detection, Correction, and Recovery

Self-testing and self-checking solutions; error-control coding; fault masking and avoidance; recovery schemes, space/time redundancy; hw/sw techniques; architectural and system-level techniques.

5. Dependability Analysis and Validation

Fault injection techniques and frameworks; dependability and characterization, cross-layer reliability analysis, dependability analysis for AI and machine learning.

6. Repair, Restructuring and Reconfiguration

Repairable logic; reconfigurable circuit design; DFT for on-line operation; self-healing; reliable FPGA-based systems.

7. Defect and Fault Tolerance

Reliable circuit/system synthesis; fault tolerant processes and design; design space exploration for dependable systems, transient/soft faults.

8. Radiation effects

SEEs on nanotechnologies; modeling of radiation environments; radiation experiments; radiation hardening techniques.

9. Aging and Lifetime Reliability

Aging characterization and modeling; design and run-time reliability, thermal, and variability management and recovery.

10. Dependable Applications and Case Studies

Methodologies and case studies: 2.5D/3D ICs, IoT, automotive/railway/avionics/space, autonomous systems, industrial control, fail-safe systems, dependable AI.

11. Emerging Technologies

Error management techniques for quantum computing, memristors, spintronics, microfluidics, approximate computing, etc.

12. Design for Security

Fault attacks, fault tolerancebased countermeasures, scan-based attacks and countermeasures, hardware trojans, system obfuscation and logic locking, secure AI, security vs. reliability, interaction between VLSI test, trust, and reliability.

Extended journal versions of invited papers from the 37th IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems 2024 are welcome. Extended papers must contain at least 30% of new material different from the original work published in the conference proceedings possibly with a reformulated text of the unmodified parts.

Manuscript submission information:

Important Dates:

    Submission Deadline: 30 November 2024
    First Round Decisions: 28 February 2025
    Revised Papers Submission: 15 April 2025 
    Decisions for the Revisions: 31 May 2025 
    Camera Ready Deadline: 30 June 2025

All manuscripts should be submitted via the Elsevier online system of the journal, available at https://www.editorialmanager.com/MICPRO. When submitting the paper, please select “VSI: DFTS 2024” as the article type. 

Special Issue on EuroMicro: 50 years of an amazing microprocessors and microsystems evolution
截稿日期: 2024-12-31

Guest editor:

Prof. Eugenio Villar
Department of Electronics Technology, Systems and Automation Engineering, University of Cantabria, Cantabria, Spain

Special issue information:

EuroMicro, the international scientific, engineering and educational organization dedicated to advancing the arts, sciences and applications of Information Technology and Microelectronics was founded in 1973, inspired by the emerging microprocessor technology.

This Special Issue of the Microprocessors and Microsystems: Embedded Hardware Design (MICPRO), the Elsevier/EuroMicro journal covering all design and architectural aspects related to embedded systems hardware, is celebrating the 50th Anniversary of Euromicro and Euromicro Conferences and Journals.

The Issue will cover, on the one hand, the amazing progress achieved by microelectronics and, as a consequence, microprocessors and microsystems, during this time. On the other hand, the state-of-the-art in selected hot research topics currently and the main open issues in these fields.

Manuscript submission information:

All manuscripts should be submitted via the Elsevier online system of the journal, available at https://www.editorialmanager.com/MICPRO. When submitting the paper, please select “SI: EuroMicro” as the article type. 

Please read the submission instructions: Guide for Authors.

Schedule

    Submission portal open date: 1 August 2024
    Submission deadline: 31 December 2024
    Acceptance deadline: 31 March 2024

Keywords:

Microprocessor OR Microsystem OR Moore’s La

Special Issue on 27th Euromicro Conference Series on Digital System Design
截稿日期: 2024-12-31

Guest editors:

    Prof. Dr. Frédéric Pétrot, Grenoble Alpes University, France
    Dr. Tomasz Kryjak, AGH University of Krakow, Poland

Special issue information:

Digital System Design is integral to the functioning and advancement of today's technology, especially in the emerging era of widespread artificial intelligence. Digital systems underpin a wide range of devices from embedded to edge to cloud (a.k.a edge to cloud continuum). They can be found in smartphones, wearables, tablets, personal computers, smart home devices, vehicles, all kinds of robots and advanced machines in factories, and finally in the data centres that are the backbone of today's digital economy. This dynamic development would not be possible without research, in particular on the optimisation and implementation of computationally intensive tasks (such as deep neural networks, today especially large language models, LLMs), on the design of heterogeneous and adaptive computing architectures composed of many different resources, and on ensuring reliability, security and privacy for all users. The aim of this special issue is to present selected recent research results from the broad DSD community.

We welcome submissions related to the wide area of Digital System Design, especially covering (but not limited) to the following topics:

    Artificial intelligence from edge to cloud: architectures, methods, tools and applications
    Design and synthesis of systems, hardware and embedded software – specification, modelling, analysis, validation and testing
    Design automation at system, processor, register-transfer, logic and physical levels
    Formal methods in system and hardware design
    IoT, cyber-physical, embedded systems and applications
    Systems-on-a-chip, networks-on-a-chip and systems-in-a-package
    High-performance, energy-efficient multi-core and many-core (heterogeneous) processor architectures.
    Autonomous/adaptable/reconfigurable systems and architectures
    Security, safety, reliability and multi-objective optimization of embedded and cyber-physical systems
    Future trends, new applications and new technologies

Manuscript submission information:

Note: This call is restricted to selected papers from the 27th edition of the Euromicro Conference on Digital Systems Design (DSD 2024). Please note that the extended paper must contain at least 30% new scientific content compared to the original paper published in the conference proceedings. Furthermore, in addition to the changes resulting from the new content, a significant rewriting of the entire paper and modification of the graphics used is expected. Authors are encouraged to provide a detailed explanation of the new content in the cover letter.

    Review process. The general guidelines of the MICPRO journal will be followed. As this is a closed call and all the papers will be extended version of contributions to DSD, we will in the first place assign reviewers from the TPC of the DSD conference.

    Draft of the call for paper at the end of the document - supplement A

    List of potential contributors - title and abstracts at the end of the document - supplement B. This are the top ranked papers from the DSD 2024 conference.

    Ways of attracting/finding potential contributors. - due to the close call not applicable. We will ask the top 20 authors, and if necessary (e.g. someone will be not interested) we will ask more authors according to the ranking.

    Tentative schedule of call, submissions, reviewing, and publication, including:

    Submission Deadline: 31 December 2024
    First Round Decisions: 31 March 2025
    Revised Papers Submission: 15 May 2025
    Decisions for the Revisions: 30 June 2025
    Camera Ready Deadline: 30 July 2025