Conference Information
ICESS 2025: International Conference on Embedded Software and Systems
https://hpcn.exeter.ac.uk/icess2025/Submission Date: |
2025-04-30 Extended |
Notification Date: |
2025-06-15 |
Conference Date: |
2025-08-13 |
Location: |
Exeter, UK |
Years: |
21 |
CORE: c Viewed: 29791 Tracked: 4 Attend: 2
Call For Papers
Welcome Message
Welcome to The 21st IEEE International Conference on Embedded Software and Systems (ICESS-2025).
The 21st IEEE International Conference on Embedded Software and Systems (ICESS) is held in Exeter, England, UK, June 26-28, 2025 International Conference on Embedded Software and Systems (ICESS) is a global forum for researchers and devel¬opers from academia, industry, and government to present and discuss emerging ideas and trends in embedded software and systems. The conference has a broad scope covering the design, implementation, optimization, and validation of embedded software and systems in various domains. With the rapid development of high-performance embedded chips, the computing power of edge devices has been greatly enhanced, enabling the devices to handle computation-intensive tasks in real time. More and more artificial intelligence (Al) applications are migrating to edge computing platforms for ensuring real-time response.The combination of edge computing and Al has given rise to edge intelligence, which is an emerging technology that integrates the core capabilities of network, computing, storage, and applications. Edge intelligence can provide users with high-quality intelligent services more efficiently by deploying intelligent algorithms on edge devices closer to users. Compared with Al models deployed on the cloud, edge intelligence has the advantages of lower power consumption, shorter latency, higher security, and closer to users. Therefore, edge intelligence has become a hot research topic in academia in recent years. In addition, Huawei, Google, Microsoft, Amazon, Cisco, and other major global enterprises have also launched their layout on this aspect, in order to accelerate the development of precision agriculture, smart healthcare, smart city, industrial Internet of Things, and other fields and related industries.
The focus of ICESS 2025 is to publish new research outcomes that are furthering the level of current research or otherwise contributing to the overall comprehension of edge intelligence related challenges like Al model deployment, task scheduling, resource management, smart design and optimization, collaborative methodologies, and software and systems solutions.
Prospective authors are invited to submit their papers to ICESS-2025. All accepted papers are expected to be included in IEEE Xplore and will be indexed by Engineering Index (EI). The authors of selected best papers will be invited post conference to extend their contributions for special issues of prestigious journals to be planned in conjunction with the conference.
Scope and Topics
Topics of interest include, but are not limited to:
Track 1: Edge Intelligence
Embedded systems and software for edge intelligence
Real-time systems and software for edge intelligence
Multimodal sensing fusion system and software for edge intelligence
Al chip design for edge intelligence
Lightweight Al model design for edge intelligence
Task scheduling and resource management for edge intelligence
Low-power and high-reliability designs for edge intelligence
Embedded Al model training methods
Al framework design and optimization for edge devices
Intelligent sensing, interaction, and decision system design
Edge-edge, edge-cloud, and end-edge-cloud collaborative methodologies
Model structure optimization, operator optimization, and hardware feature optimization for robotics, UAVs, autonomous driving, etc.
Other edge intelligence systems and applications
Track 2: Systems, Models & Algorithms
Embedded System Architecture
Embedded Software Architectures
Embedded OS, Scheduling and Runtime Support
Embedded Storage and I/O Systems
Real-Time Embedded Systems
Distributed and Networked Embedded Systems
Fault Tolerant and Trusted Embedded Systems
Power and Thermal Aware Computing
Mixed-Criticality Embedded Systems
Heterogeneous SoC and Multicore Embedded System
Reconfigurable Embedded Computing
Track 3: Design Methodology & Tools
Design Technologies of Embedded Systems
Formal Methods for Embedded Systems
Middleware for Embedded Systems
IDE and Software Tools
Hardware/Software Co-Design
Component-Based Embedded Software Design
Model-based Design for Embedded Software
Domain/Application-Specific Design Techniques
Testing Techniques for Embedded Software/Systems
Verification and Validation for Embedded Systems
Compilation and Debug Techniques and Tools
Performance Evaluation Techniques and Tools
Safety of Machine Learning for Embedded Systems
Track 4: Emerging Embedded Applications & Interdisciplinary
Intelligent Embedded Systems
Machine Learning for Embedded Applications
Internet-of-Things (loT)
Wearable Computing
Smart City
Intelligent Intersection Traffic Signal Control
Robotics and Control Systemse
Wireless Sensor Networks
Cyber-Physical Systems (CPS)
Assured Autonomy for Safety-Critical CPS
Automotive and Avionics Systems
Medical Systems
Database & Multimedia Systems
Network Protocols and Security
Emergency and Disaster Management
Consumer Electronics - Mobile Cloud Computing and Approximate Computing
Industrial Practices and Case Studies
Last updated by Dou Sun in 2025-02-05
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| Full Name | Impact Factor | Publisher |
|---|---|---|
| Discover Applied Sciences | 2.800 | Springer |
| International Journal of Photoenergy | 2.100 | Hindawi |
| Wireless Communications and Mobile Computing | Hindawi | |
| International Journal of Microwave Science and Technology | Hindawi | |
| International Journal of Parallel Programming | 0.900 | Springer |
| New Ideas in Psychology | 2.300 | Elsevier |
| Applied Computational Intelligence and Soft Computing | 2.400 | Hindawi |
| IEEE Transaction on Emerging Topics in Computing | 5.100 | IEEE |
| Computational Social Networks | Springer | |
| IEEE Transactions on Circuits and Systems Part II: Express Briefs | 4.000 | IEEE |