会议信息
innoLAE 2019: Innovations in Large-Area Electronics Conference
http://www-large-area-electronics.eng.cam.ac.uk/innoLAE2019截稿日期: |
2018-09-30 |
通知日期: |
2018-10-31 |
会议日期: |
2019-01-22 |
会议地点: |
Cambridge, UK |
届数: |
5 |
浏览: 8575 关注: 0 参加: 0
征稿
Large-Area Electronics (LAE) is a new way of making electronics and includes printed, flexible, plastic, organic and bio- electronics. LAE has the potential to both open up new markets for electronics and to expand existing products by adding new form factors, new functionality and enabling new cost structures. Applications abound in high growth industrial sectors such as healthcare and medical, sport and fitness, fast moving consumer goods, automotive, the Internet of Everything, printing and packaging and smart wearables. innoLAE 2019 represents a unique opportunity to hear the latest developments from academic and industrial teams active in LAE research and technology, including keynotes and invited talks from leading international organisations.
最后更新 Dou Sun 在 2018-07-01
相关会议
相关期刊
CCF | 全称 | 影响因子 | 出版商 | ISSN |
---|---|---|---|---|
b | Formal Aspects of Computing | 1.400 | ACM | 0934-5043 |
c | Journal of Visual Communication and Image Representation | 2.600 | Elsevier | 1047-3203 |
b | Empirical Software Engineering | 3.500 | Springer | 1382-3256 |
b | Computer Networks | 4.6 | Elsevier | 1389-1286 |
Computational Mechanics | 3.700 | Springer | 0178-7675 | |
IEEE Intelligent Systems | 5.600 | IEEE | 1541-1672 | |
Journal of Documentation | 1.700 | Emerald | 0022-0418 | |
IEEE Computer Architecture Letters | 1.400 | IEEE | 1556-6056 |
全称 | 影响因子 | 出版商 |
---|---|---|
Formal Aspects of Computing | 1.400 | ACM |
Journal of Visual Communication and Image Representation | 2.600 | Elsevier |
Empirical Software Engineering | 3.500 | Springer |
Computer Networks | 4.6 | Elsevier |
Computational Mechanics | 3.700 | Springer |
IEEE Intelligent Systems | 5.600 | IEEE |
Journal of Documentation | 1.700 | Emerald |
IEEE Computer Architecture Letters | 1.400 | IEEE |