Información de la Revista
IEEE Transactions on VLSI Systems (TVLSI)
https://tvlsi.ieee.org/index.html
Factor de Impacto:
2.800
Editor:
IEEE
ISSN:
1063-8210
Vistas:
14549
Seguidores:
11
Solicitud de Artículos
Scope and Call for Papers

The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.

Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.

To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.

Submissions relating to analog and mixed-signal circuits and architectures must be consistent with the emphasis area of the Transactions, namely VLSI/ULSI technologies and implementations. While it is not essential to demonstrate large scale integration in the submission, the eventual applicability of the material to VLSI/ULSI systems should be clear, and when possible, highlighted by the authors. Publications demonstrating measurements and experimental verification of designs are encouraged.
Última Actualización Por Dou Sun en 2024-07-30
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