Conference Information
VTS 2026: VLSI Test Symposium
https://tttc-vts.org/public_html/new/2026/
Submission Date:
2025-11-03
Notification Date:
2026-01-31
Conference Date:
2026-04-27
Location:
Napa, California, USA
Years:
44
CCF: c   QUALIS: a2   Viewed: 28144   Tracked: 21   Attend: 2

Call For Papers
The program includes keynotes, scientific paper presentations, short industrial application paper presentations, special sessions, and Innovative Practices sessions.

You are invited to participate and submit your contributions to VTS’26. The areas of interest include (but are not limited to) the following topics:

VTS Topics

    Generative AI Applications in Test and Security
    Silicon Lifecycle Management
    Silent Data Corruption
    Test-Enabled Digital Twin
    Analog – Mixed-Signal – RF Test
    ATPG and Compression
    Automotive Test and Safety
    Built-In Self-Test (BIST)
    Functional safety
    Digital twin-enabled test and security
    High BW Test through High-Speed Interfaces
    Testing for extreme environments
    Test og Non-Si and Compound Circuits
    Test and Security of Quantum Circuits
    Test and Security of Photonic Circuits
    Test and Security of Emerging Memory Technologies
    Functional Debug through Scan
    Fault Modeling and Simulation
    Low-Power IC Test
    Machine Learning for Test and Security
    Microsystems/MEMS/Sensors Test
    Memory Test and Repair
    Test for 3D and Heterogenous Integration
    Yield Optimization
    Online Test and Error Correction
    Power and Thermal Issues in Test
    System-on-Chip (SOC) Test
    Test and Reliability of Biomedical Devices
    Test and Reliability of High-Speed I/O
    Test and Security of Machine Learning Hardware
    Test Standards
    FPGA Test
    Defect-Based Test
    Defect and Fault Tolerance
    Delay and Performance Test
    Design for Testability
    Post-silicon Validation and Debug
    Hardware Security
    Embedded System and Board Test
Last updated by Dou Sun in 2025-09-16
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Related Journals
CCFFull NameImpact FactorPublisherISSN
VLSI DesignHindawi1065-514X
bIEEE Transactions on VLSI Systems2.800IEEE1063-8210
IEEE Design & Test1.900IEEE2168-2356
ICT Express4.100Elsevier2405-9595
ISA Transactions6.5Elsevier0019-0578
International journal of VLSI Design & Communication SystemsAIRCC0976-1527
Journal of Sensors1.400Hindawi1687-725X
Sensors3.400MDPI1424-8220
Journal of Electronic Testing1.100Springer0923-8174
IETE Journal of Research1.300Taylor & Francis0377-2063
Full NameImpact FactorPublisher
VLSI DesignHindawi
IEEE Transactions on VLSI Systems2.800IEEE
IEEE Design & Test1.900IEEE
ICT Express4.100Elsevier
ISA Transactions6.5Elsevier
International journal of VLSI Design & Communication SystemsAIRCC
Journal of Sensors1.400Hindawi
Sensors3.400MDPI
Journal of Electronic Testing1.100Springer
IETE Journal of Research1.300Taylor & Francis