期刊信息
Smart Science
https://www.tandfonline.com/toc/tsma20/current出版商: |
Taylor & Francis |
ISSN: |
2308-0477 |
浏览: |
7984 |
关注: |
0 |
征稿
Smart Science (ISSN 2308-0477) is an international, peer-reviewed journal that publishes significant original scientific researches, and reviews and analyses of current research and science policy. We welcome submissions of high quality papers from all fields of science and from any source. Articles of an interdisciplinary nature are particularly welcomed. Smart Science aims to be among the top multidisciplinary journals covering a broad spectrum of smart topics in the fields of materials science, chemistry, physics, engineering, medicine, and biology. Smart Science is currently focusing on the topics of Smart Manufacturing (CPS, IoT and AI) for Industry 4.0, Smart Energy and Smart Chemistry and Materials. Other specific research areas covered by the journal include, but are not limited to: 1. Smart Science in the Future 2. Smart Manufacturing Cyber-Physical System (CPS) Internet of Things (IoT) and Internet of Brain (IoB) Artificial Intelligence Smart Computing Smart Design/Machine Smart Sensing Smart Information and Networks 3. Smart Energy and Thermal/Fluidic Science 4. Smart Chemistry and Materials Peer review policy All manuscripts are pre-checked by editors, and if appropriate, sent for single blind peer review. Contributions must be original, not previously or simultaneously published elsewhere, also are critically reviewed before they are published. For in-depth review, at least two outside referees are consulted. Reviewers are contacted before being sent a paper and are asked to return comments within 3 weeks for most papers. Reviewers may be selected to evaluate separate components of a manuscript. We greatly appreciate the time spent in preparing a review, and will consult you on a revision of a manuscript only if we believe the paper has been significantly improved but still requires input. The responsibility of final decisions on acceptance or rejection of a submitted manuscript lies with the editors. Editors reserve the right to reject papers without sending them out for review.
最后更新 Dou Sun 在 2020-03-19
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ISPRS International Journal of Geo-Information | 2.800 | MDPI |
IEEE Signal Processing Magazine | 9.400 | IEEE |
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Electrical Engineering: An International Journal | AIRCC | |
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相关会议
简称 | 全称 | 截稿日期 | 会议日期 |
---|---|---|---|
ACC | American Control Conference | 2019-09-23 | 2020-07-01 |
AFIN | International Conference on Advances in Future Internet | 2022-06-12 | 2022-10-16 |
CMIT | International Conference of Managing Information Technology | 2022-05-07 | 2022-05-21 |
AIID | International Conference on Artificial Intelligence and Industrial Design | 2023-08-17 | 2023-11-17 |
ICMCM | International Conference on Mechatronics and Computational Mechanics | 2020-03-17 | 2020-04-23 |
ITCCMA | International Conference on Information Technology, Control, Chaos, Modeling and Applications | 2023-09-02 | 2023-09-16 |
ICCS | International Conference on Computational Science | 2024-02-02 | 2024-07-02 |
ICICSP | IEEE International Conference on Information Communication and Signal Processing | 2024-08-15 | 2024-09-21 |
SCAI' | International Conference on Soft Computing, Artificial Intelligence and Applications | 2023-12-16 | 2023-12-23 |
ICDF2C | EAI International Conference on Digital Forensics & Cyber Crime | 2024-04-30 | 2024-10-09 |
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