Información de la conferencia
SLIP 2019: International Workshop on System Level Interconnect Prediction
http://www.sliponline.org/Día de Entrega: |
2019-03-22 |
Fecha de Notificación: |
2019-04-07 |
Fecha de Conferencia: |
2019-06-02 |
Ubicación: |
Las Vegas, Nevada, USA |
Años: |
21 |
Vistas: 12441 Seguidores: 0 Asistentes: 0
Solicitud de Artículos
Technical topics include but are not limited to: Learning and predictive models for optimizing interconnect at various IC and system design stages System-level design for FPGAs, NoCs, reconfigurable systems Design, analysis, and (co)optimization of power and clock networks Topologies and fabrics of multi- and many-core architectures Power consumption of interconnects System level reliability, aging, and thermal issues Security-aware power/clock delivery and interconnect design Design-for-manufacturing (DFM) and yield techniques for interconnects High speed chip-to-chip interconnect Design and analysis of chip-package interfaces 3D interconnect design and prediction Applications of interconnects to social, genetic, and biologicalsystems Emerging interconnect technologies in machine learning platforms & chips
Última Actualización Por Dou Sun en 2019-03-31
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IWoMR | International Workshop on Mobile Robotics | 2021-08-28 |
i3D | ACM SIGGRAPH Symposium on Interactive 3D Graphics and Games | 2025-05-03 |
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Nombre Completo | Factor de Impacto | Editor |
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Computers & Industrial Engineering | 6.5 | Elsevier |
Advances in Bioinformatics | Hindawi | |
Journal of Documentation | 1.700 | Emerald |
Physical Communication | 2.2 | Elsevier |
Circuits, Systems, and Signal Processing | 1.800 | Springer |
Computing and Informatics | Institute of Informatics, Slovakia | |
Journal of Information Security and Applications | 3.800 | Elsevier |
Journal of Computer Networks and Communications | 2.000 | Hindawi |
IEEE Journal of Selected Topics in Signal Processing | 13.7 | IEEE |
Brain-Computer Interfaces | 1.800 | Taylor & Francis |