Conference Information
SLIP 2019: International Workshop on System Level Interconnect Prediction
http://www.sliponline.org/Submission Date: |
2019-03-22 |
Notification Date: |
2019-04-07 |
Conference Date: |
2019-06-02 |
Location: |
Las Vegas, Nevada, USA |
Years: |
21 |
Viewed: 10569 Tracked: 0 Attend: 0
Call For Papers
Technical topics include but are not limited to: Learning and predictive models for optimizing interconnect at various IC and system design stages System-level design for FPGAs, NoCs, reconfigurable systems Design, analysis, and (co)optimization of power and clock networks Topologies and fabrics of multi- and many-core architectures Power consumption of interconnects System level reliability, aging, and thermal issues Security-aware power/clock delivery and interconnect design Design-for-manufacturing (DFM) and yield techniques for interconnects High speed chip-to-chip interconnect Design and analysis of chip-package interfaces 3D interconnect design and prediction Applications of interconnects to social, genetic, and biologicalsystems Emerging interconnect technologies in machine learning platforms & chips
Last updated by Dou Sun in 2019-03-31
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