Conference Information
AICSS 2025: International Symposium on Artificial Intelligence and Computational Social Sciences
https://www.ai-css.net/Submission Date: |
2025-06-25 |
Notification Date: |
2025-08-01 |
Conference Date: |
2025-09-19 |
Location: |
Beijing, China |
Viewed: 919 Tracked: 0 Attend: 1
Call For Papers
The topics of interest for submission include, but are not limited to: Big Data and Knowledge Engineering Database and data warehouse Text mining Social network analysis Online Behavior Analysis Sentiment analysis Group behavior modeling and simulation Urban computing Computational social psychology Multimodal interaction Social computing Knowledge graph construction, retrieval and reasoning Social media mining Computational linguistics Causal reasoning Machine learning
Last updated by Dou Sun in 2025-06-16
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Related Journals
CCF | Full Name | Impact Factor | Publisher | ISSN |
---|---|---|---|---|
IEEE Transactions on Signal Processing | 4.600 | IEEE | 1053-587X | |
Computing and Informatics | Institute of Informatics, Slovakia | 1335-9150 | ||
b | World Wide Web | 2.700 | Springer | 1386-145X |
ACM Transactions on Modeling and Computer Simulation | 0.700 | ACM | 1049-3301 | |
ACM SIGMIS Database | ACM | 0095-0033 | ||
SIGMOD Record | ACM | 0163-5808 | ||
Social Science Computer Review | 3.000 | SAGE | 0894-4393 | |
b | Knowledge and Information Systems | 2.500 | Springer | 0219-1377 |
EPJ Data Science | 3.000 | Springer | 2193-1127 | |
Journal of Materials Processing Technology | 7.5 | Elsevier | 0924-0136 |
Full Name | Impact Factor | Publisher |
---|---|---|
IEEE Transactions on Signal Processing | 4.600 | IEEE |
Computing and Informatics | Institute of Informatics, Slovakia | |
World Wide Web | 2.700 | Springer |
ACM Transactions on Modeling and Computer Simulation | 0.700 | ACM |
ACM SIGMIS Database | ACM | |
SIGMOD Record | ACM | |
Social Science Computer Review | 3.000 | SAGE |
Knowledge and Information Systems | 2.500 | Springer |
EPJ Data Science | 3.000 | Springer |
Journal of Materials Processing Technology | 7.5 | Elsevier |
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