会议信息
ICAIM 2025: International Conference on Artificial Intelligence & Materials
https://www.ic-aim.net/截稿日期: |
2024-11-10 |
通知日期: |
2025-02-15 |
会议日期: |
2025-03-21 |
会议地点: |
Qingdao, China |
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征稿
The International Conference on Artificial Intelligence & Materials (ICAIM) committed to the deep integration and common enhancement in materials science, artificial intelligence (AI) technology. Topics of interest for submission include: Novel AI lgorithms that have potential applications to materials Computer-aided design of novel materials AI for materials science Digital twin technology with AI for materials industry Modelling techniques for manufacturing processes and systems boosted with AI Materials theory assisted by AI technology High-Performance Computing (HPC) for modeling, simulation, and analysis applicable to materials and AIs Advanced manufacturing materials Nanomedical materials in drug delivery and drug release, gene and immune therapy nanostructured coatings for enhanced adhesive, anti-bacterial, anti-viral properties, and anti-fouling properties Regenerative biomaterials, materials with engineered interfaces, self-assembled materials, materials with selective mechanical and functional properties, and multi-scale scaffolds for tissue engineering and thrombogenic control, and dental materials for soft and hard tissue reconstruction and regeneration 3D/4D printing for bioactive materials Theoretical (In-Silico) Biomaterials modeling, design, and AI applications
最后更新 Dou Sun 在 2024-11-29
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全称 | 影响因子 | 出版商 |
---|---|---|
SIGMOD Record | ACM | |
Computing and Informatics | Institute of Informatics, Slovakia | |
ACM SIGMIS Database | ACM | |
Knowledge and Information Systems | 2.500 | Springer |
EPJ Data Science | 3.000 | Springer |
ACM Transactions on Design Automation of Electronic Systems | 2.200 | ACM |
Social Science Computer Review | 3.000 | SAGE |
ACM Transactions on Modeling and Computer Simulation | 0.700 | ACM |
World Wide Web | 2.700 | Springer |
Software Quality Journal | 1.700 | Springer |