会议信息
DMEE 2018: International Conference on Design, Mechanical and Electrical Engineering
http://www.dmee.org/截稿日期: |
2018-04-05 |
通知日期: |
2018-04-25 |
会议日期: |
2018-09-07 |
会议地点: |
Bali, Indonesia |
浏览: 7060 关注: 0 参加: 0
征稿
This conference welcomes all contributions from those who wish to report on Design, Mechanical and Electrical Engineering fields within the following scopes: MACHINE DESIGN Actuator Systems Coatings and Surface Modification Contact Mechanics Cutting/ Forming/ Grinding/ Polishing Design for Manufacturability (DFM) Friction and Wear Mechanism Hydro-dynamic/ Static Lubrication/Lubricants/Lubrication Failure Injection Molding/ Mold and Die Integrated Product and Process Design (IPPD) Machine Design/ Machine Elements ELECTRICAL ENGINEERING Computer and AI Applications in Power Industry Control Science and Control Engineering Fuel Cells and Renewable Energy Systems Electric Vehicle Technologies Electrotechnologies Intelligent Control Systems Signal and Communication Processing Advanced Power Semiconductors Electrical Machinery and Electrical Apparatus Electromagnetic compatibility Materials for Electrotechnics Measuring Technology and Instruments Power Electronics and Power Drives Power Optimization Power System and its Automation MECHANICAL CONTROL AND AUTOMATION ENGINEERING Mechanical Dynamics Precision Machinery Precision Manufacturing and Measurement Manufacturing and Production Processes Production Management Information Management Materials Processing Materials Engineering Industrial and Manufacturing Systems Analysis Automotive Electronic Control Measurement Technology MECHANICS Basic Mechanics Hydromechanics/Fluid Mechanics Mechanics of Explosion Oscillation and Wave Other Disciplines of Mechanics Physical Mechanics Solid Mechanics Statistical Mechanics Thermodynamics Biomechanics Environment Mechanics
最后更新 Dou Sun 在 2018-03-18
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相关期刊
CCF | 全称 | 影响因子 | 出版商 | ISSN |
---|---|---|---|---|
c | Service Oriented Computing and Applications | 1.800 | Springer | 1863-2386 |
Journal of Advanced Manufacturing Systems | World Scientific | 0219-6867 | ||
c | ACM Journal on Emerging Technologies in Computing Systems | 2.100 | ACM | 1550-4832 |
b | SIAM Journal on Imaging Sciences | SIAM | 1936-4954 | |
IEEE Transactions on Nanotechnology | 2.100 | IEEE | 1536-125X | |
International Journal on Cybernetics & Informatics | AIRCC | 2320-8430 | ||
ACM Transactions on Asian and Low-Resource Language Information Processing | 1.800 | ACM | 2375-4699 | |
Multibody System Dynamics | 2.600 | Springer | 1384-5640 | |
a | IEEE Transactions on Software Engineering | 6.500 | IEEE | 0098-5589 |
Electronic Journal of e-Learning | Academic Publishing Limited | 1479-4403 |
全称 | 影响因子 | 出版商 |
---|---|---|
Service Oriented Computing and Applications | 1.800 | Springer |
Journal of Advanced Manufacturing Systems | World Scientific | |
ACM Journal on Emerging Technologies in Computing Systems | 2.100 | ACM |
SIAM Journal on Imaging Sciences | SIAM | |
IEEE Transactions on Nanotechnology | 2.100 | IEEE |
International Journal on Cybernetics & Informatics | AIRCC | |
ACM Transactions on Asian and Low-Resource Language Information Processing | 1.800 | ACM |
Multibody System Dynamics | 2.600 | Springer |
IEEE Transactions on Software Engineering | 6.500 | IEEE |
Electronic Journal of e-Learning | Academic Publishing Limited |
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