会议信息
MSETEE 2018: International Conference on Materials Science, Energy Technology and Environmental Engineering
http://msetee.org/index.html截稿日期: |
2018-04-10 |
通知日期: |
|
会议日期: |
2018-05-18 |
会议地点: |
Changsha, China |
届数: |
3 |
浏览: 8647 关注: 0 参加: 0
征稿
The 2018 3rd International Conference on Materials Science, Energy Technology and Environmental Engineering (MSETEE 2018) aims to provide a high-level international forum for researchers, engineers and scientists to present the new advances and research results in the fields of energy materials and environment engineering. The topics of interest for submission include, but are not limited to: I. Materials Science and Engineering II. Materials Processing III. Green Materials IV. Chemical Sciences V. Food Technology VI. Environmental Engineering VII. Resources and Environment VIII. Energy Engineering IX. Power Engineering X. Electrical and Electronic XI. Energy and Power XII. Related topics
最后更新 Dou Sun 在 2018-03-16
相关会议
相关期刊
CCF | 全称 | 影响因子 | 出版商 | ISSN |
---|---|---|---|---|
Journal of Mathematical Cryptology | Walter de Gruyter | 1862-2976 | ||
a | IEEE Transactions on Software Engineering | 6.500 | IEEE | 0098-5589 |
IEEE Open Journal of the Industrial Electronics Society | 5.200 | IEEE | 2644-1284 | |
Computation | MDPI | 2079-3197 | ||
c | ACM Journal on Emerging Technologies in Computing Systems | 2.100 | ACM | 1550-4832 |
Electronic Commerce Research | 3.700 | Springer | 1389-5753 | |
Photonics and Nanostructures - Fundamentals and Applications | 2.500 | Elsevier | 1569-4410 | |
International Journal of UbicComp | AIRCC | 0976-2213 | ||
Annals of Software Engineering | Springer | 1022-7091 |
全称 | 影响因子 | 出版商 |
---|---|---|
Journal of Mathematical Cryptology | Walter de Gruyter | |
IEEE Transactions on Software Engineering | 6.500 | IEEE |
IEEE Open Journal of the Industrial Electronics Society | 5.200 | IEEE |
Computation | MDPI | |
ACM Journal on Emerging Technologies in Computing Systems | 2.100 | ACM |
Electronic Commerce Research | 3.700 | Springer |
Photonics and Nanostructures - Fundamentals and Applications | 2.500 | Elsevier |
International Journal of UbicComp | AIRCC | |
Annals of Software Engineering | Springer |
推荐