Conference Information
DAIS 2026: International Conference on Distributed Applications and Interoperable Systems
https://www.discotec.org/2026/daisSubmission Date: |
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Notification Date: |
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Conference Date: |
2026-06-08 |
Location: |
Urbino, Italy |
Years: |
26 |
CORE: b QUALIS: b2 Viewed: 24064 Tracked: 4 Attend: 0
Call For Papers
Scope
The DAIS conference series addresses all practical and conceptual aspects of distributed applications, including their design, modeling, implementation and operation, the supporting middleware, appropriate software engineering methodologies and tools, as well as experimental studies and applications. Submissions will be judged on their originality, significance, clarity, relevance, and technical correctness.
The topics of interest to the conference include, but are not limited to:
Novel and innovative distributed applications and systems, particularly in the areas of
middleware,
cloud, edge and fog computing,
big data processing,
distributed embedded machine learning (TinyML),
decentralised/distributed AI/ML,
streaming and complex event processing,
distributed social networking,
IoT and cyber-physical systems,
mobile computing,
advanced networking (SDN/NFV),
micro-services and service-oriented computing,
peer-to-peer systems, and
data center and internet-scale systems.
Novel architectures and mechanisms, particularly in the areas of
publish/subscribe systems,
epidemic protocols,
language-based approaches,
virtualization and resource allocation,
distributed storage,
large-scale data management,
trusted execution environments,
blockchains, cryptocurrencies and smart contracts, and
distributed consensus mechanisms.
System issues and design goals, including
interoperability and adaptation,
self-* properties (e.g., self-organization, self-management,…),
security and practical applications of cryptography,
trust and privacy,
cooperation incentives and fairness,
fault-tolerance and dependability,
scalability and elasticity, and
tail-performance and energy-efficiency.
Last updated by Dou Sun in 2025-11-21
Acceptance Ratio
| Year | Submitted | Accepted | Accepted(%) |
|---|---|---|---|
| 2010 | 53 | 17 | 32.1% |
| 2009 | 33 | 12 | 36.4% |
| 2008 | 66 | 24 | 36.4% |
| 2007 | 74 | 24 | 32.4% |
| 2006 | 78 | 26 | 33.3% |
| 2005 | 44 | 22 | 50% |
| 2003 | 88 | 26 | 29.5% |
| 2001 | 65 | 26 | 40% |
| 1999 | 88 | 32 | 36.4% |
| 1997 | 31 | 22 | 71% |
Best Papers
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Related Journals
| CCF | Full Name | Impact Factor | Publisher | ISSN |
|---|---|---|---|---|
| International Journal of Distributed and Parallel Systems | AIRCC | 2229-3957 | ||
| International Journal of Instrumentation and Control Systems | AIRCC | 2319-412X | ||
| International Journal of Computer Applications in Technology | Inderscience | 0952-8091 | ||
| c | Future Generation Computer Systems | 6.2 | Elsevier | 0167-739X |
| c | IEEE Transactions on Computational Social Systems | 4.500 | IEEE | 2373-7476 |
| a | IEEE Transactions on Parallel and Distributed Systems | 5.600 | IEEE | 1045-9219 |
| b | ACM Transactions on Design Automation of Electronic Systems | 2.200 | ACM | 1084-4309 |
| c | The Journal of Strategic Information Systems | 11.8 | Elsevier | 0963-8687 |
| Design Automation for Embedded Systems | 0.900 | Springer | 0929-5585 | |
| IEEE Journal of Miniaturized Air and Space Systems | IEEE | 2576-3164 |
| Full Name | Impact Factor | Publisher |
|---|---|---|
| International Journal of Distributed and Parallel Systems | AIRCC | |
| International Journal of Instrumentation and Control Systems | AIRCC | |
| International Journal of Computer Applications in Technology | Inderscience | |
| Future Generation Computer Systems | 6.2 | Elsevier |
| IEEE Transactions on Computational Social Systems | 4.500 | IEEE |
| IEEE Transactions on Parallel and Distributed Systems | 5.600 | IEEE |
| ACM Transactions on Design Automation of Electronic Systems | 2.200 | ACM |
| The Journal of Strategic Information Systems | 11.8 | Elsevier |
| Design Automation for Embedded Systems | 0.900 | Springer |
| IEEE Journal of Miniaturized Air and Space Systems | IEEE |