会议信息
SEC'' 2024: ACM/IEEE Symposium on Edge Computing
http://acm-ieee-sec.org/2024/
截稿日期:
2024-06-14
通知日期:
2024-09-20
会议日期:
2024-12-04
会议地点:
Rome, Italy
届数:
9
浏览: 22717   关注: 11   参加: 3

征稿
SEC takes a broad view of edge computing and solicits contributions from many fields of systems practice that embrace any aspect of edge computing. 

Topics include, but are not limited to:

    communication infrastructure (e.g., cellular, satellite, LoRa) for edge computing
    distributed ledger technology (DLT) & blockchain at the edge
    socio-economic aspects of edge computing
    edge computing as an enabler of 5G applications and services
    edge computing infrastructure (e.g., IoT hubs) and its sustainability
    emerging applications at the edge, such as the metaverse, smart environments, and remote sensing
    geo-distributed analytics and indexing on edge nodes
    hardware architectures for edge computing and devices
    monitoring, measurements, management, and diagnosis in edge computing
    networking, e.g., from clients to the edge, and from the edge to the cloud
    programming models and toolkits
    resource management, scalability, and reliability for edge computing
    security and privacy issues
    storage and data management technologies for edge computing
    techniques and algorithms for machine learning and AI at the edge
    edge-enabled applications, such as in vehicular, enterprise, and manufacturing systems

Submissions that include systems implementation and their performance evaluation are particularly encouraged. 

The review process will be double-blind. Papers will be judged on novelty, significance, clarity, relevance, and correctness. A best paper award will be presented to one or more outstanding papers from the conference. We also welcome short Position Papers on any of the above topics, which will be judged separately from papers in the research track of the conference. By submitting a paper, you agree that at least one of the authors will attend the conference to present it. Papers must be in PDF format and must be submitted through:

https://sec24.hotcrp.com/.  No email submissions will be accepted.
最后更新 Dou Sun 在 2024-05-14
相关会议
CCFCOREQUALIS简称全称截稿日期通知日期会议日期
SCNLPAsia Conference on Soft Computing and Natural Language Processing2023-07-152023-07-252023-07-28
GMEEInternational Conference on Green Materials and Environmental Engineering2020-12-28 2021-02-02
ICIITInternational conference on Intelligent Information Technologies2024-09-302024-10-302025-02-20
CDICSInternational Conference on Data, Information and Computing Science2024-11-052024-11-202024-12-06
SAI'International Conference on Soft Computing, Artificial Intelligence and Applications2023-03-112023-03-112023-03-25
cbHPCCInternational Conference on High Performance Computing and Communications2024-09-102024-09-302024-12-13
bb1ADBISEuropean Conference on Advances in Databases and Information Systems2024-04-152024-06-102024-08-28
bSOCCACM Symposium on Cloud Computing2024-07-082024-09-252024-11-20
JISTThe Joint International Semantic Technology Conference2019-08-102019-09-142019-11-25
CTCNetAsia Pacific Conference on Computing Technologies, Communications and Networking2024-07-052024-07-102024-07-26
相关期刊
CCF全称影响因子出版商ISSN
Advances in Data Analysis and Classification1.400Springer1862-5347
IEEE Transactions on Haptics2.400IEEE1939-1412
Ethics and Information Technology3.400Springer1388-1957
Journal of Digital Imaging2.900Springer0897-1889
cMultimedia Systems3.500Springer0942-4962
Interaction Studies0.900John Benjamins Publishing Company1572-0373
Active and Passive Electronic Components1.300Hindawi0882-7516
cBMC Bioinformatics2.900BioMed Central1471-2105
bACM Transactions on Embedded Computing Systems2.800ACM1539-9087
全称影响因子出版商
Advances in Data Analysis and Classification1.400Springer
IEEE Transactions on Haptics2.400IEEE
Ethics and Information Technology3.400Springer
Journal of Digital Imaging2.900Springer
Multimedia Systems3.500Springer
Interaction Studies0.900John Benjamins Publishing Company
Active and Passive Electronic Components1.300Hindawi
BMC Bioinformatics2.900BioMed Central
ACM Transactions on Embedded Computing Systems2.800ACM
推荐