会议信息
3DUI 2015: IEEE Symposium on 3D User Interfaces
http://3dui.org/截稿日期: |
2014-09-08 Extended |
通知日期: |
|
会议日期: |
2015-03-23 |
会议地点: |
Arles, France |
届数: |
10 |
CORE: b QUALIS: b2 浏览: 14856 关注: 0 参加: 1
征稿
The IEEE Symposium on 3D User Interfaces 2015 is the tenth international symposium focused on the topic of 3D User Interfaces (3DUI). It provides an unique opportunity for industrial and academic researchers to exchange about the state-of-the-art 3DUI research!
The symposium will last for two days, and will be followed immediately by the IEEE Virtual Reality 2015 conference. All areas of 3DUI research will be presented, including:
3D input devices
3D display and sensory feedback
3D interaction techniques
3D user interface metaphors
Desktop 3DUIs
3DUIs for VR and AR
Evaluation methods for 3DUIs
Biologically inspired 3DUIs
Human perception of 3D interaction
Collaborative 3D interaction
Applications of 3DUIs: games, entertainment, CAD, education, etc
Researchers can participate in a number of ways, including submitting full technical papers, technotes, and posters. In addition, there will be our annual 3D User Interface competition: the 3DUI Contest.
Looking forward to meeting you at the 3DUI 2015 Symposium!
最后更新 Dou Sun 在 2014-09-07
录取率
| 时间 | 提交数 | 录取数 | 录取率(%) |
|---|---|---|---|
| 2015 | 64 | 20 | 31.3% |
| 2014 | 72 | 16 | 22.2% |
| 2013 | 79 | 21 | 26.6% |
| 2012 | 71 | 22 | 31% |
| 2011 | 44 | 15 | 34.1% |
| 2010 | 60 | 20 | 33.3% |
| 2009 | 68 | 18 | 26.5% |
| 2008 | 67 | 19 | 28.4% |
| 2007 | 81 | 18 | 22.2% |
| 2006 | 81 | 26 | 32.1% |
最佳论文
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| SysInt | International Conference on System-Integrated Intelligence | 2013-12-06 | 2014-07-02 |
| ESWC | Extended Semantic Web Conference | 2024-12-12 | 2025-06-01 |
| VL/HCC | IEEE Symposium on Visual Languages and Human-Centric Computing | 2024-04-19 | 2024-09-02 |
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相关期刊
| CCF | 全称 | 影响因子 | 出版商 | ISSN |
|---|---|---|---|---|
| IEEE Cloud Computing Magazine | IEEE | 2325-6095 | ||
| IEEE Network | 6.800 | IEEE | 0890-8044 | |
| ACM/IMS Journal of Data Science | ACM | 2831-3194 | ||
| IEEE Solid-State Circuits Letters | 2.200 | IEEE | 2573-9603 | |
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| b | ACM Transactions on Multimedia Computing, Communications and Applications | 5.200 | ACM | 1551-6857 |
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| VLSI Design | Hindawi | 1065-514X | ||
| c | Discrete & Computational Geometry | 0.600 | Springer | 0179-5376 |
| 全称 | 影响因子 | 出版商 |
|---|---|---|
| IEEE Cloud Computing Magazine | IEEE | |
| IEEE Network | 6.800 | IEEE |
| ACM/IMS Journal of Data Science | ACM | |
| IEEE Solid-State Circuits Letters | 2.200 | IEEE |
| IEEE Internet Computing Magazine | 3.700 | IEEE |
| ACM Transactions on Multimedia Computing, Communications and Applications | 5.200 | ACM |
| IEEE Transactions on Learning Technologies | 2.900 | IEEE |
| VLSI Design | Hindawi | |
| Discrete & Computational Geometry | 0.600 | Springer |
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