会議情報
ISVC 2024: International Symposium on Visual Computing
http://www.isvc.net/提出日: |
2024-07-15 |
通知日: |
2024-08-25 |
会議日: |
2024-10-21 |
場所: |
Lake Tahoe, Nevada, USA |
年: |
19 |
CORE: c 閲覧: 29272 追跡: 19 出席: 5
論文募集
The 19th International Symposium on Visual Computing (ISVC’24) will take place in Lake Tahoe, Nevada, USA, October 21-23, 2024 (at Harrah’s Lake Tahoe Resort and Casino). ISVC provides a common forum for researchers, scientists, engineers, and practitioners to present their latest research findings, ideas, developments, and applications in visual computing. In particular, ISVC seeks papers contributing to the state of the art and practice in the four main areas of visual computing: (1) computer vision, (2) computer graphics, (2) visualization, and (4) virtual reality. Of special interest are papers that combine ideas from two or more areas. The symposium will consist of invited and contributed presentations, six keynote presentations, special tracks, and poster sessions covering all areas of visual computing. *** Important Dates *** (All deadlines are at 11:59 PM Pacific Daylight Time) Paper Submissions July 15, 2024 Notification of Acceptance August 25, 2024 Final Paper September 24, 2024 Early Registration September 24, 2024 Hotel Reservation September 24, 2024 ISVC’24 October 21-23, 2024 *** Keynote Speakers *** Duncan Jim, Yale University Weinshall Daphna, Hebrew Univ of Jerusalem Barbic Jernej, Univ of Southern California Lin Ming, University of Maryland Endert Alex, Georgia Institute of Technology Greg Mori, SFU & Borealis AI *** Computer Vision Chairs *** Patel Vishal, Johns Hopkins University Gu Jinwei, NVIDIA *** Computer Graphics Chairs *** Panetta Julian, University of California, Davis Gingold Yotam, George Mason University *** Visualization Chairs *** Dutta Soumya, Indian Insti of Tech, Kanpur Biswas Ayan, Los Alamos National Lab *** Virtual Reality Chairs *** Johnsen Kyle, University of Georgia Arefin S Mohammed, Colorado State Univ *** Steering Committee *** Bebis George, Univ of Nevada, Reno (chair) Coquillart Sabine, INRIA Klosowski James, AT&T Labs Research Kuno Yoshinori, Saitama University Lin Steve, Microsoft Research Lindstrom Peter, Lawrence Livermore Nat Lab Moreland Kenneth, Oak Ridge National Laboratory Nefian Ara, NASA Ames Research Center Tafti Ahmad P., University of Pittsburgh *** Submission and Review Process *** This is a fully refereed symposium. Papers submitted to ISVC must not be currently under consideration for publication in another conference. Each submission will be reviewed by three members of the Program Committee (PC) using a “double-blind” review process to determine its appropriateness for acceptance and presentation (oral or poster) at ISVC. Therefore, submissions should not contain names or other information revealing the authors’ identity. Papers will be reviewed with an emphasis on the potential to contribute to the state of the art in the field. Selection criteria include accuracy and originality of ideas, clarity and significance of results, and presentation quality. Papers should be submitted in camera-ready format and their length should match that intended for final publication. *** Publication *** The symposium's proceedings are published by Springer in the Lecture Notes in Computer Science (LNCS) series. Information on abstracting and indexing of the LNCS series can be found using the link below. https://www.springer.com/gp/computer-science/lncs/information-on-abstracting-and-indexing/799288 *** Special Issue *** Authors of selected papers presented at ISVC’24 will be invited to submit an extended version of their work for expedited review and possible publication in a special issue on Advances in Visual Computing in the Machine Vision and Applications journal (to be confirmed) ISVC. The paper submission deadline is tentatively on March 15, 2025, with the publication of the special issue expected by the end of 2025. *** Attendance *** ISVC is a premier forum for presenting and discussing current research in visual computing. At least one author must attend and present the paper at the symposium. If none of the authors can attend the symposium and present their paper(s) due to unforeseen reasons, they should contact the steering committee chair to make alternative arrangements (i.e., recorded presentation or presentation by another attendee). Papers not presented at the symposium without a valid reason will be withdrawn from the symposium proceedings. *** Job Posting *** If your institution or company has any job openings, you can post an announcement free of charge on the ISVC website using the link below. http://isvc.net/index.php/jobs/ *** Sponsorship *** There are several sponsorship opportunities available this year, please follow the link below for more information. http://isvc.net/index.php/sponsorship-application/
最終更新 Dou Sun 2024-04-16
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関連仕訳帳
CCF | 完全な名前 | インパクト ・ ファクター | 出版社 | ISSN |
---|---|---|---|---|
c | EURASIP Journal on Information Security | 2.500 | Springer | 1687-417X |
Journal of Machine Engineering | Wroclaw Board of Scientific Technical | 1895-7595 | ||
Entropy | 2.100 | MDPI | 1099-4300 | |
BIT Numerical Mathematics | 1.600 | Springer | 0006-3835 | |
Ethics and Information Technology | 3.400 | Springer | 1388-1957 | |
Journal of Digital Imaging | 2.900 | Springer | 0897-1889 | |
c | Wireless Communications and Mobile Computing | Hindawi | 1530-8669 | |
c | BMC Bioinformatics | 2.900 | BioMed Central | 1471-2105 |
Active and Passive Electronic Components | 1.300 | Hindawi | 0882-7516 | |
Advances in Data Analysis and Classification | 1.400 | Springer | 1862-5347 |
完全な名前 | インパクト ・ ファクター | 出版社 |
---|---|---|
EURASIP Journal on Information Security | 2.500 | Springer |
Journal of Machine Engineering | Wroclaw Board of Scientific Technical | |
Entropy | 2.100 | MDPI |
BIT Numerical Mathematics | 1.600 | Springer |
Ethics and Information Technology | 3.400 | Springer |
Journal of Digital Imaging | 2.900 | Springer |
Wireless Communications and Mobile Computing | Hindawi | |
BMC Bioinformatics | 2.900 | BioMed Central |
Active and Passive Electronic Components | 1.300 | Hindawi |
Advances in Data Analysis and Classification | 1.400 | Springer |
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