会议信息
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
https://nordic.imapseurope.org/nordpac/截稿日期: |
2024-01-31 |
通知日期: |
2024-06-01 |
会议日期: |
2024-06-11 |
会议地点: |
Tampere, Finland |
届数: |
8 |
浏览: 3727 关注: 0 参加: 0
征稿
Topics Proposed topics of microelectronics and packaging include: Optoelectronics Harsh environment Applications Advanced Packaging Electronics Reliability & Quality Materials & Processes Medical electronics Power electronics Wearable electronics Green Technologies Printed electronics Advanced packaging for MEMS & sensors & sensor systems
最后更新 Dou Sun 在 2023-12-04
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相关期刊
CCF | 全称 | 影响因子 | 出版商 | ISSN |
---|---|---|---|---|
International Journal of Computer Mathematics | 1.700 | Taylor & Francis | 0020-7160 | |
Journal of Advanced Manufacturing Systems | World Scientific | 0219-6867 | ||
Brain Sciences | 2.700 | MDPI | 2076-3425 | |
b | Formal Methods in System Design | 0.700 | Springer | 0925-9856 |
Digital Applications in Archaeology and Cultural Heritage | Elsevier | 2212-0548 | ||
Journal of Experimental Algorithmics | ACM | 1084-6654 | ||
ACM Transactions on Management Information Systems | 2.500 | ACM | 2158-656X | |
Progress in Artificial Intelligence | 2.000 | Springer | 2192-6352 | |
IEEE Journal of Selected Topics in Signal Processing | 13.7 | IEEE | 1932-4553 | |
c | Engineering Applications of Artificial Intelligence | 7.5 | Elsevier | 0952-1976 |
全称 | 影响因子 | 出版商 |
---|---|---|
International Journal of Computer Mathematics | 1.700 | Taylor & Francis |
Journal of Advanced Manufacturing Systems | World Scientific | |
Brain Sciences | 2.700 | MDPI |
Formal Methods in System Design | 0.700 | Springer |
Digital Applications in Archaeology and Cultural Heritage | Elsevier | |
Journal of Experimental Algorithmics | ACM | |
ACM Transactions on Management Information Systems | 2.500 | ACM |
Progress in Artificial Intelligence | 2.000 | Springer |
IEEE Journal of Selected Topics in Signal Processing | 13.7 | IEEE |
Engineering Applications of Artificial Intelligence | 7.5 | Elsevier |