会议信息
SCOM 2023: International Conference on Soft Computing
https://cse2023.org/scom/index截稿日期: |
2023-08-05 Extended |
通知日期: |
2023-08-10 |
会议日期: |
2023-08-19 |
会议地点: |
Chennai, India |
届数: |
11 |
浏览: 7580 关注: 0 参加: 0
征稿
Scope 11th International Conference on Soft Computing (SCOM 2023) provides a forum for researchers who address this issue and to present their work in a peer-reviewed forum. Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to these topics only. We expect that the conference and its publications will be a trigger for further related research and technology improvements in this important subject. The topics suggested by this conference can be discussed in term of concepts, surveys, state of the art, research, standards, implementations, running experiments, applications and industrial case studies. Authors are invited to submit complete unpublished papers, which are not under review in any other conference or journal in the following, but not limited to.. Topics of Interest · Fuzzy Systems · Neural Networks · Machine learning · Probabilistic Reasoning · Evolutionary Computing · Pattern Recognition · Hybrid intelligent systems · Software agents · Morphic Computing · Image processing · E-commerce, E-medicine · Rough Sets · Symbolic machine learning · Wavelet · Signal or Image Processing · Vision Recognition · Biomedical Engineering · Telecommunications · Reactive Distributed AI · Nano & Micro-systems · Data Visualization Paper Submission Authors are invited to submit papers through the Submission System by August 05, 2023(Final Call). Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS&IT) series(Confirmed). Selected papers from SCOM 2023, after further revisions, will be published in the special issue of the following journals • International Journal on Soft Computing (IJSC) • International Journal on Soft Computing, Artificial Intelligence and Applications (IJSCAI) • Information Technology in Industry (ITII) Important Dates • Submission Deadline: August 05,2023(Final Call) • Authors Notification: August 14, 2023 • Registration & Camera-Ready Paper Due: August 16, 2023 Contact Us Here's where you can reach us : scom@cse2023.org or scom_conf@yahoo.com Submission Link https://cse2023.org/submission/index.php
最后更新 Jayden Hunter 在 2023-07-31
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相关期刊
CCF | 全称 | 影响因子 | 出版商 | ISSN |
---|---|---|---|---|
Intelligence & Robotics | OAE Publishing | 2770-3541 | ||
c | EURASIP Journal on Information Security | 2.500 | Springer | 1687-417X |
International Journal of Computational Science, Information Technology and Control Engineering | AIRCC | 2394–7527 | ||
Active and Passive Electronic Components | 1.300 | Hindawi | 0882-7516 | |
c | BMC Bioinformatics | 2.900 | BioMed Central | 1471-2105 |
c | Information Retrieval | 1.700 | Springer | 1386-4564 |
Advances in Data Analysis and Classification | 1.400 | Springer | 1862-5347 | |
IEEE Transactions on Haptics | 2.400 | IEEE | 1939-1412 | |
Ethics and Information Technology | 3.400 | Springer | 1388-1957 |
全称 | 影响因子 | 出版商 |
---|---|---|
Intelligence & Robotics | OAE Publishing | |
EURASIP Journal on Information Security | 2.500 | Springer |
International Journal of Computational Science, Information Technology and Control Engineering | AIRCC | |
Active and Passive Electronic Components | 1.300 | Hindawi |
BMC Bioinformatics | 2.900 | BioMed Central |
Information Retrieval | 1.700 | Springer |
Advances in Data Analysis and Classification | 1.400 | Springer |
IEEE Transactions on Haptics | 2.400 | IEEE |
Ethics and Information Technology | 3.400 | Springer |
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