会议信息
ICMSN 2020: International Conference on Materials Sciences and Nanomaterial
http://www.icmsn.org/截稿日期: |
2020-02-20 |
通知日期: |
2020-03-10 |
会议日期: |
2020-07-08 |
会议地点: |
Cambridge, UK |
届数: |
4 |
浏览: 10948 关注: 0 参加: 0
征稿
2020 The 4th International Conference on Materials Sciences and Nanomaterials (ICMSN 2020) involves the field of Materials Sciences and Nanomaterials. Topics of interest for submission include, but are not limited to: Topic one (Nanomaterials): -Different Methods for Growth of Nanostructures -Nanostructured Thin Films and Coatings -Doped Nanomaterials -Modification of Nanomaterials -Characterisation of Nanomaterials -Nanocomposites -Organic,Inorganic,and Biomedical of Nanomaterials -Different Kinds and Morphologies of Nanostructures: Metal and Metal Oxide of Nanoparticle,Nanowires and Nanorod,Carbon Nanotube and Graphene -Nanostructured Ceramic -Mechanical,Thermal,Electrical,Optical and Magnetic Properties of Nanomaterials -Nanoengineering Topic Two (Electronic Materials): -Electronic MaterialsSemiconductor Materials -Display Materials -Battery Materials -Optical Materials -Dielectric Materials -Ferroelectric Materials -Conductive Metal Topic Three (Material Chemistry): -Materials ChemistryClassical Analytical Chemistry -Instrumental Analysis -Optical Analysis -Polymer Science -Material Processing -Structural Chemistry -Material Shaping Topic four (Materials Processing Engineering): Materials Processing EngineeringMetallurgy Technology Polymer Materials Polymer Processing Metalworking Casting Welding Topic five (Structural Material): Structural MaterialsWrought Iron Cast Iron Steel Stainless Steel Reinforced Concrete Prestressed Concrete Aluminum Composites Masonry Timber
最后更新 Dou Sun 在 2019-12-19
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简称 | 全称 | 会议日期 |
---|---|---|
ICSCC' | International Conference on Smart Cities and Communities | 2018-07-24 |
ISAAI | International Symposium on Applied Artificial Intelligence | 2019-11-20 |
SGESG | International Symposium on Green Energy and Smart Grid | 2020-08-20 |
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相关期刊
CCF | 全称 | 影响因子 | 出版商 | ISSN |
---|---|---|---|---|
Numerical Heat Transfer, Part B: Fundamentals | 1.700 | Taylor & Francis | 1040-7790 | |
a | ACM Transactions on Software Engineering and Methodology | 6.2 | ACM | 1049-331x |
The Journal of High Technology Management Research | Elsevier | 1047-8310 | ||
a | IEEE Transactions on Software Engineering | 6.500 | IEEE | 0098-5589 |
Journal of Medical Systems | 3.500 | Springer | 0148-5598 | |
Artificial Intelligence and Autonomous Systems | ELSP | 2959-0744 | ||
International Journal of Ad hoc, Sensor & Ubiquitous Computing | AIRCC | 0976-2205 | ||
International Journal of Wireless Information Networks | 1.500 | Springer | 1068-9605 | |
International Journal of UbicComp | AIRCC | 0976-2213 | ||
c | Expert Systems | 3.000 | John Wiley & Sons | 1468-0394 |
全称 | 影响因子 | 出版商 |
---|---|---|
Numerical Heat Transfer, Part B: Fundamentals | 1.700 | Taylor & Francis |
ACM Transactions on Software Engineering and Methodology | 6.2 | ACM |
The Journal of High Technology Management Research | Elsevier | |
IEEE Transactions on Software Engineering | 6.500 | IEEE |
Journal of Medical Systems | 3.500 | Springer |
Artificial Intelligence and Autonomous Systems | ELSP | |
International Journal of Ad hoc, Sensor & Ubiquitous Computing | AIRCC | |
International Journal of Wireless Information Networks | 1.500 | Springer |
International Journal of UbicComp | AIRCC | |
Expert Systems | 3.000 | John Wiley & Sons |