Conference Information
APCCAS 2018: IEEE Asia Pacific Conference on Circuits and Systems
http://apccas.com/index.htmlSubmission Date: |
2018-07-31 Extended |
Notification Date: |
2018-08-30 |
Conference Date: |
2018-10-26 |
Location: |
Chengdu, China |
Years: |
14 |
Viewed: 18364 Tracked: 4 Attend: 0
Call For Papers
IEEE APCCAS 2018 welcomes author submission of papers concerning any branch of the Circuits and Systems, and their applications ineducation, and other subjects. Topics of interest for submission include any topics on Circuits and Systems. Analog Circuits Biomedical and Life-Science Circuits, Systemsand Applications Circuits and Systems for Communication Digital Signal Processing Embedded Systems Emerging Technologies for Circuits and Systems HP/HV IC Designs Memory Circuits and Systems Mixed Signal Circuits Multimedia Systems and Applications Nanoelectronics and Gigascale Systems Neural Systems and Applications Nonlinear Circuits and Systems Power and Energy Circuits and Systems RF/mm-Wave IC Design and Technology Sensory Systems System-on-Chip and CAD Testing Technology Visual Signal Processing and Communications VLSI Systems & Applications 3D IC Design LIVE DEMO Submission Track Analog and Mixed-Signal Circuits and Systems Digital Circuits and Systems Power/Energy Devices, Circuits and Systems Communication Circuits and Systems High-Speed and Optical Wirelined Circuits and Systems Biomedical and Healthcare Circuits and Systems Digital Signal Processing Sensors and Interfaces Design Automation Nanoelectronics, Devices and Hybrid System Integration Neural Networks and Neuromorphic Engineering Nonlineary Systems and Circuit Theory Visual Signal Processing and Communications Multimedia Systems and Applications Education in Circuits and Systems ▶View the information about each Track Chairs Special Session - Call for Paper Special Session Title: Emerging threats in the IoT era: chip reliability and security Topic: 1. hardware Trojan design and countermeasure 2. analysis of side and covert channel for both 2D and 3D chips 3. timing, reliability, variability, power-related attacks for IoT chips 4. secure and trustworthy IoT chip architecture 5. ultra low power and reliable IoT chip design Special Session Title: Reconfigurable Architecture for Future Intelligent Systems (Read More) Topic: 1. FPGA based reconfigurable AI accelerator; 2. Systematic design for intelligent applications using FPGA based solution; 3. FPGA-based low-power objective detection and analysis for automatic driving and computer vision; 4. Reconfigurable architecture with FPGA verfication; 5. FPGA based heterogeneous computing platform;
Last updated by Dou Sun in 2018-07-29
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