会议信息
ICEMP 2023: International Conference on Engineering Mathematics and Physics
http://icemp.org/
截稿日期:
2023-05-20 Extended
通知日期:
2023-06-10
会议日期:
2023-07-05
会议地点:
Kuala Lumpur, Malaysia
届数:
12
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征稿
ICEMP 2023 will bring together leading engineers and scientists in Engineering Mathematics and Physics from around the world.

Topics of interest for submission include, but are not limited to:

Advanced Numerical Algorithms
Algorithmic Approaches to Computational Kernels and Applications
Application of Soft Computing, Knowledge Engineering, and Machine Learning
Applications of Computation as a Scientific Paradigm
Artificial Intelligence and Soft Computing (Neural, Fuzzy, Evolutionary Systems)
Automation, Control and Robotics
Aviation & Space Technology
Bioengineering and Bioinformatics
Biomedical Physics and Engineering
Boundary Element Methods
Circuits, Networks and Systems
Complex Systems: Modeling and Simulation
Computation in Complex Networks
Computational Science and Engineering
Computational Mathematics
Computational Mechanics, Economics, Finance and Statistics
Computational Physics, Chemistry, Biology and Medicine
Computational Statistics
Control of Dynamical Systems
Dynamical Systems
Electronics, Microelectronics and Nanoelectronics
Engineering Mathematics
High Performance Computing
Hybrid Computational Methods
Industrial Mathematics
Instrumentation and Measurement
Materials Science
Mathematical Methods in Sciences and Engineering
Mathematical Modeling
Mathematical models for the information society
Mathematical models in Economy and Insurance
Mathematical models in Medicine
Mechanics and Fluid Mechanics
Meshless Methods
Multimedia and Video Systems
Nonlinear Analysis
Numerical Techniques
Optimization Inverse Problems
Parallel and Distributed Computing
Parallel Numerical Algorithms
最后更新 Dou Sun 在 2023-05-03
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