Información de la conferencia
MSME 2026: International Conference on Materials Science and Manufacturing Engineering
https://msme2026.org/Día de Entrega: |
2025-12-05 |
Fecha de Notificación: |
2026-01-05 |
Fecha de Conferencia: |
2026-04-09 |
Ubicación: |
Shenzhen, China |
Años: |
7 |
Vistas: 23421 Seguidores: 0 Asistentes: 0
Solicitud de Artículos
MSME 2026 is now accepting manuscript submissions. Prospective authors are invited to submit their draft paper to electronic contribution system. The submitted paper should be in PDF format. The topics of interest are included below, but not limited to: Materials Science Topics Advanced materials Biomaterials Composite materials Energy materials Renewable material Functional materials Nano materials Building materials Chemical materials 3D materials Cryogenic materials Smart materials Optical/Electronic/Magnetic materials Material characteristics Manufacturing Engineering Topics Additive manufacturing Advanced Manufacturing and Infrastructure Application of evolutionary computing techniques in manufacturing operations Computer-integrated manufacturing systems Energy and materials for manufacturing Laser technology and applications Machine tools technology Machining and forming technology Manufacturing planning, optimization and simulation Materials joining Micro and nano-fabrication Non-traditional material removal processes Precision engineering, inspection, measurement and metrology Robotics, mechatronics and manufacturing automation Smart manufacturing and systems Sustainable and green manufacturing Virtual manufacturing
Última Actualización Por Dou Sun en 2025-09-02
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Revistas Relacionadas
CCF | Nombre Completo | Factor de Impacto | Editor | ISSN |
---|---|---|---|---|
Numerical Heat Transfer, Part B: Fundamentals | 1.700 | Taylor & Francis | 1040-7790 | |
a | ACM Transactions on Software Engineering and Methodology | 6.2 | ACM | 1049-331x |
The Journal of High Technology Management Research | Elsevier | 1047-8310 | ||
IEEE Industrial Electronics Magazine | 5.600 | IEEE | 1932-4529 | |
International Journal of UbicComp | AIRCC | 0976-2213 | ||
c | Expert Systems | 3.000 | John Wiley & Sons | 1468-0394 |
Journal of Information Science | 1.800 | SAGE | 0165-5515 | |
Language Learning & Technology | 3.800 | University of Hawaii Press | 1094-3501 | |
a | IEEE Transactions on Software Engineering | 6.500 | IEEE | 0098-5589 |
Journal of Cloud Computing | Springer | 2192-113X |
Nombre Completo | Factor de Impacto | Editor |
---|---|---|
Numerical Heat Transfer, Part B: Fundamentals | 1.700 | Taylor & Francis |
ACM Transactions on Software Engineering and Methodology | 6.2 | ACM |
The Journal of High Technology Management Research | Elsevier | |
IEEE Industrial Electronics Magazine | 5.600 | IEEE |
International Journal of UbicComp | AIRCC | |
Expert Systems | 3.000 | John Wiley & Sons |
Journal of Information Science | 1.800 | SAGE |
Language Learning & Technology | 3.800 | University of Hawaii Press |
IEEE Transactions on Software Engineering | 6.500 | IEEE |
Journal of Cloud Computing | Springer |