Conference Information
IIRW 2016: IEEE International Integrated Reliability Workshop
http://www.iirw.orgSubmission Date: |
2016-07-25 Extended |
Notification Date: |
|
Conference Date: |
2016-10-09 |
Location: |
Stanford Sierra, California, USA |
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Call For Papers
Scope
We invite you to submit a presentation proposal that addresses any semiconductor related reliability issue, including the following topics:
Designing-in reliability (products, circuits, systems, processes)
Resistive memory: degradation mechanisms
Deep sub-micron transistor and circuit reliability
Customer product reliability requirements / manufacturer reliability tasks
Root cause defects, physical mechanisms, and simulations
Wafer level reliability tests, test approaches, and reliability test structures
Abstract Submission
Please prepare your two-page extended abstract (maximum two pages including figures) in pdf format, and submit it to the following URL: https://easychair.org/conferences/?conf=iirw2016
Please follow the IEEE template when preparing your abstract.
All submissions will be acknowledged by email within one week. If you do not receive acknowledgement of your submission, please contact the Technical Program Chair. Your abstract should state clearly and concisely the results of your work and why they are significant. Representative data and figures that support your proposal are REQUIRED.
Additional Information
For further information please contact the Technical Program Chair:
Tom Kopley, Fairchild
Email: tpc.iirw2016@gmail.com
Last updated by Xin Yao in 2016-07-24
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