Información de la conferencia
TEI 2026: International Conference on Tangible, Embedded and Embodied Interaction
https://tei.acm.org/2026/Día de Entrega: |
2025-07-31 |
Fecha de Notificación: |
2025-10-15 |
Fecha de Conferencia: |
2026-03-08 |
Ubicación: |
Chicago, Illinois, USA |
Años: |
20 |
CORE: a QUALIS: b1 Vistas: 19043 Seguidores: 4 Asistentes: 0
Solicitud de Artículos
We invite paper submissions from a wide range of perspectives: technical, applied, empirical, theoretical, philosophical, conceptual, and artistic. We welcome contributions from fields including but not limited to: tangible interaction design, embodied interaction design, embedded computing, digital fabrication, hybrid craft, e-textiles, wearables, haptics, robotics, smart cities, smart materials, and sustainability. As this year's theme is 'Tide + Tied', we invite submissions that explore interdisciplinary knowledge, bridging the physical and digital, technology and humanity, resurgence and convergence, and beyond. We expect submissions to be clearly framed within the rapidly developing tangible, embedded, and embodied interaction field. Works framed as research through design and more technical contributions are particularly welcome. Authors are encouraged to submit a paper with a length proportional to its contribution. While there is no maximum or minimum length for papers, the length of typical submissions is expected to be approximately 7,000–8,000 words excluding references, figure/table captions, and appendices. Reviewers will be instructed to weigh the contribution of a submission relative to its method and length. Papers should be succinct but thorough in presenting the work. Shorter, more focused papers are encouraged and will be reviewed like any other paper. Papers whose lengths are incommensurate with their contributions will be rejected. General Information TEI 2026 is the 20th annual conference dedicated to tangible, embedded, and embodied interaction. The ACM TEI conference brings together researchers, practitioners, artists, designers and students from a variety of disciplines, including interaction design, computer science, engineering, product design, media studies and the arts. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, demonstrations, posters, art installations, performances, hands-on studios, and scholarly workshops. We invite paper submissions from a wide range of perspectives: technical, applied, empirical, theoretical, philosophical, conceptual, and artistic. We welcome contributions from fields including but not limited to: tangible interaction design, embodied interaction design, embedded computing, digital fabrication, hybrid craft, e-textiles, wearables, haptics, robotics, smart cities, smart materials, and sustainability. As this year's theme is 'Tide + Tied', we invite submissions that explore interdisciplinary knowledge, bridging the physical and digital, technology and humanity, resurgence and convergence, and beyond. We expect submissions to be clearly framed within the rapidly developing tangible, embedded, and embodied interaction field. Works framed as research through design and more technical contributions are particularly welcome.
Última Actualización Por Dou Sun en 2025-10-28
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| Abreviación | Nombre Completo | Conferencia |
|---|---|---|
| HotOS | USENIX Workshop on Hot Topics in Operating Systems | 2025-05-14 |
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| Nombre Completo | Factor de Impacto | Editor |
|---|---|---|
| ACM Transactions on Programming Languages and Systems | 1.500 | ACM |
| International Journal of Photoenergy | 2.100 | Hindawi |
| IEEE Solid-State Circuits Magazine | IEEE | |
| ACM Transactions on Spatial Algorithms and Systems | 1.900 | ACM |
| Mobile Information Systems | Hindawi | |
| Cortex | 3.200 | Elsevier |
| Biometric Technology Today | Elsevier | |
| International Journal of Robotics Research | 5.0 | SAGE |
| Journal of Medical Systems | 3.500 | Springer |
| Microprocessors and Microsystems: Embedded Hardware Design | 1.900 | Elsevier |